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| Products name: | Factory Hot Sale Thermal Pad High Temperature Resistant Thermal Insulated Gap Pad Gpu Laptop Thermal Silicone Pad | Thermal conductivity& Compostion: | 2.0W/m-K |
|---|---|---|---|
| Continuos Use Temp: | -40℃ to 200℃ | Construction: | Ceramic filled silicone elastomer |
| Specific Gravity: | 2.7g/cc | Keywords: | Thermal Silicone Pad |
| Hardness: | 20±5 Shore 00 | Color: | Gray |
| Thickness: | 1.0mmT | Application: | LED CPU GPU MOS Laptop |
Factory Hot Sale Thermal Pad High Temperature Resistant Thermal Insulated Gap Pad Gpu Laptop Thermal Silicone Pad
TIF540-20-11US series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
Features:
> Excellent thermal conductivity 2.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized
Applications:
> Cooling components to the chassis of frame
> CPU and GPU processors and other chipsets
> High-performance computing (HPC)
> Industrial equipment
> Network communication devices
> New energy vehicles
> LED CPU GPU MOS
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
| Typical Properties of TIF540-20-11US Series | ||
| Color | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ***** |
| Specific Gravity | 2.7 g/cc | ASTM D792 |
| thickness | 1.0mmT | ASTM D374 |
| Hardness (thickness＜1.0mm) | 20±5 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -40 to 200℃ | ****** |
| Dielectric Breakdown Voltage | ≥5500 VAC | ASTM D149 |
| Dielectric Constant | 4.5 MHz | ASTM D150 |
| Volume Resistivity | ≥1.0*1012 Ohm-cm | ASTM D150 |
| Fire rating | 94 V0 | UL (E331100) |
| Thermal conductivity | 2.0 W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials.
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract.
5.Free sample offer.
6.Quality assurance contract.
コンタクトパーソン: Dana Dai
電話番号: 18153789196
