Glory Escort: Ziitek Thermal Conductive Materials Assist Shanghai Terjin Unmanned Aerial Vehicle, Safeguarding Low-Flying Safety on the Victory Day of the "September 3rd Military Parade"

On the morning of September 3, 2025, a grand ceremony was held in Beijing to commemorate the 80th anniversary of the victory of the Chinese People's Resistance Against Japanese Aggression and the World Anti-Fascist War. Above Tiananmen Square, fighter jets were soaring, and on the ground, a continuous stream of vehicles was moving. A grand military parade was held. This military parade was of great significance. Many new types of equipment were showcased, among which unmanned and anti-unmanned equipment, as key components of new quality combat capabilities, demonstrated the leapfrog development of China's national defense science and technology.

Behind this highly anticipated and historic event, there was countless hours of meticulous preparation and strict protection. The hundreds of sets of unmanned aerial vehicle detection and defense equipment dispatched by Shanghai Special Forces served as the "invisible shield" for ensuring low-altitude safety at the scene. Once again, they did not disappoint and successfully completed the security mission, ensuring the safety of the military parade.

The unmanned aerial vehicle (UAV) jammer/interference device of Shanghai Terjin is the core component of the low-altitude defense system. During the execution of tasks, the internal high-power radio frequency chips (RF Chips) and digital signal processors (DSP/FPGA) and other core components will generate a large amount of heat. Especially when operating continuously in complex outdoor environments throughout the day, the heat dissipation poses a severe challenge:

Performance attenuation risk: Heat accumulation leads to an increase in the chip's junction temperature, causing "thermal throttling", resulting in a shorter shielding distance and slower response of the equipment, directly affecting the security effectiveness.
Equipment reliability risk: Long-term operation under high temperatures will accelerate the aging of electronic components and even cause system downtime. In the context of major event support, any minor malfunction is unacceptable.

Environmental adaptability requirements: The equipment must be able to withstand outdoor exposure to sunlight, rain, and changes in temperature throughout the day, and the heat dissipation materials must possess excellent long-term stability and weather resistance.
Therefore, an efficient, stable and reliable cooling solution is the physical foundation that ensures Shanghai Tekin equipment is always in a good working condition and can successfully complete tasks without any problems.

In response to the high power, high integration and high reliability requirements of the Shanghai Terjin unmanned aerial vehicle shielding device, Ziitek Electronics has provided a professional thermal conductive material application solution to ensure the "cool" operation of the equipment.

Between the high-power RF chip and the heat dissipation housing, there is a TIF thermal conductive silicone sheet.

1. By filling the gap between the chip and the metal shielding shell or the heat dissipation base plate with Mako thermal conductive silicone sheet, it is possible to effectively fill the air gap, establish a high heat conduction channel, and quickly transfer the heat generated by the chip to the device casing and release it into the external air.
Excellent thermal conductivity: Offers a range of thermal conductivities: 1.2 - 25 W/m·K for selection, meeting the requirements of different heat flux densities.
2. Insulation and shock resistance: The material itself has excellent electrical insulation properties, which can protect the chip. At the same time, it is soft and has a buffering effect, making it suitable for vibrations and shocks in vehicle-mounted and outdoor mobile environments.
3. Easy installation: It can be pre-formed and has inherent micro-adhesiveness, making it convenient for quick installation and maintenance, and suitable for large-scale production.

Between the central processor and the compact heat sink, TIG thermal conductive silicone grease

1. For CPU/FPGA chips with extremely limited space and high thermal conductivity requirements, MegaCool thermal conductive silicone grease should be adopted. It can completely fill the microscopic unevenness on the surface of the chip and the heat sink, achieving a low contact thermal resistance and realizing efficient heat dissipation.
Excellent thermal conductivity: Offers a range of thermal conductivities: 1.5 - 5.6 W/m·K for selection.
2. Ultra-low thermal resistance: The high-purity filler formula ensures excellent thermal conductivity, effectively reducing the temperature of the core chip.
3. High-temperature stability: Resistant to high temperatures, non-curing, non-dripping. Its performance remains unchanged even under long-term high-temperature operation, ensuring the equipment operates stably and continuously.

The success of every national event is the result of the joint efforts of enterprises along the entire industrial chain. Shanghai Terjin, with its outstanding technical strength, ensures the safety of low-altitude airspace in the country. Meanwhile, Ziitek, with its excellent thermal conductivity material technology, quietly safeguards the stable operation of Shanghai Terjin's unmanned aerial vehicle equipment.

Ziitek Electronic Materials Technology is honored to be able to contribute to the security work for the 9.3 Victory Day military parade in this way. Together with Shanghai Terjin and all national enterprises, we deeply cherish our sense of patriotism, fulfill the social responsibility of contributing to the country through the industry, and jointly build a solid low-altitude security defense line.