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商品の詳細:
お支払配送条件:
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| 製品名: | 電気サーマルシリコーンギャップ充填冷却パッド熱吸収導電性絶縁パッド | 変電気変数 @1MHz: | 4.5 |
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| サンプル: | サンプル無料 | 連続使用温度: | -40 200℃に |
| 硬度: | 65/35 ショア00 | 炎の評価: | UL 94 V-0 |
| 応用: | 電気、ラップトップ、ヒートシンク、CPU GPU LED クーラー | 熱伝導性（w/mk）: | 1.8W/mK |
| 建設と合成: | セラミック充填シリコーンエラストマー | キーワード: | サーマルギャップ冷却パッド |
Electric Thermal Silicone Gap Filling Cooling Pad Thermal Absorbing Conductive Insulating Pad
Products description
The TIF®100-18-56E Series is a well-balanced,general-purpose thermal pad.It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.
Features:
> Good thermal conductive :1.8W/mK
> Good softness and fillability
> Self-adhesive without the need for additional surface adhesive
> Good insulation performance
Applications:
> Home appliance industry
> Power module
> Wearable device
> Solar photovoltaic panel
> LED lighting fixtures
> CPU
> Display card
> Mainboard/mother board
> Notebook
| Typical Properties of TIF®100-18-56E Series | |||
| Property | Value | Test method | |
| Color | Green | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 2.3 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.00) | ||
| Hardness | 65 Shore 00 | 35 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 4.5 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 1.8 W/m-K | ASTM D5470 | |
| 1.8 W/m-K | ISO22007 | ||
Product Specifications
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mmX406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Our services
Online-service : 12 hours , Inquiry reply within fastest.
Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).
Well-trained & experienced staff are to answer all your inquiries in English of course.
Standard Export Carton Or Marked With Customer's Information Or Customized.
Provide free samples
After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof.
we will help you to deal with it and give you satisfactory solution.
コンタクトパーソン: Dana Dai
電話番号: +86 18153789196
