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High-Performance Silicone Gap Pads Ultra Soft Thermal Pad For Electronic Components 5G,Aerospace, AI

中国 Dongguan Ziitek Electronic Materials & Technology Ltd. 認証
中国 Dongguan Ziitek Electronic Materials & Technology Ltd. 認証
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High-Performance Silicone Gap Pads Ultra Soft Thermal Pad For Electronic Components 5G,Aerospace, AI

High-Performance Silicone Gap Pads Ultra Soft Thermal Pad For Electronic Components 5G,Aerospace, AI

大画像 :  High-Performance Silicone Gap Pads Ultra Soft Thermal Pad For Electronic Components 5G,Aerospace, AI

商品の詳細:
起源の場所: 中国
ブランド名: ZIITEK
証明: UL and RoHs
モデル番号: TIF100-30-23S
お支払配送条件:
最小注文数量: 1000個
価格: 交渉可能
パッケージの詳細: 1000 個/バッグ
受渡し時間: 3-5作業日
供給の能力: 10000/日
詳細製品概要
製品名: 高性能シリコンギャップパッド電子部品5G、航空宇宙、AI用超ソフトサーマルパッド キーワード: サーマルパッド
構造及びCompostion: セラミック充填シリコンエラストマー 色: 水色
厚さの範囲: 0.25〜5.0mm(0.010〜0.20インチ) 硬度: 65海岸00
熱伝導率: 3.0W/m-K 申請について: 電子部品 5G、航空宇宙、AI

High-Performance Silicone Gap Pads Ultra Soft Thermal Pad For Electronic Components 5G,Aerospace, AI


Company Profile


Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
 

Products description


TIS®100-30-23S Series is a well-balanced, general-purpose thermal pad.It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs,achieving the best balance between cost and performance.
 
Features:

 

> Higt thermal conductivity
> Good softness and fillability
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance


Applications:

 

> Electronic Components 5G,Aerospace, AI,

> AIoT, AR/VR/MR/XR, Automotive,Consumer Devices,

> Datacom,Electric Vehicle,Electronic Products,

> Energy Storage,Industrial, Lighting Equipment,

> Medical, Military, Netcom, Panel,

> Power Electronics,Robot,Servers,

> Smart Home,Telecom,etc.

 

Typical Properties of TIF®100-30-23S Series
Property Value Test method
Color Light blue Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.15 ASTM D792
Thickness Range(inch/mm)

0.010~0.020

(0.25~0.5)

0.030~0.200

(0.75~5.0)

ASTM D374
Hardness 65 Shore 00 45 Shore 00 ASTM 2240
Continuos Use Temp -40 to 200℃ ***
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 5.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Thermal Conductivity(W/m.K) 3.0 ASTM D5470
Fire rating V-0 UL 94 (E331100)

 

Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"× 16" (406 mm×406 mm)
 
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

High-Performance Silicone Gap Pads Ultra Soft Thermal Pad For Electronic Components 5G,Aerospace, AI 0

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

 

FAQ:

 

Q: Are you trading company or manufacturer ? 

A: We are manufacturer in China.

 

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

 

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.  

連絡先の詳細
Dongguan Ziitek Electronic Materials & Technology Ltd.

コンタクトパーソン: Dana Dai

電話番号: 18153789196

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