logo
ホーム 製品熱伝導パッド

High Performance Thermal Pad Manufacturer Soft Silicone Thermal Cooling Pad For Laptop AI Processors Cooling

中国 Dongguan Ziitek Electronic Materials & Technology Ltd. 認証
中国 Dongguan Ziitek Electronic Materials & Technology Ltd. 認証
熱伝導性のパッドはで非常によい見、働かせます。私達に他の熱伝導性のパッドのための必要性が今ありません!

—— ピーターGoolsby

私は2年間Ziitekに協力しました、それらは良質の熱伝導性材料を提供し、時間の配達は、相変化材料を推薦します

—— Antonello Sau

良質、よいサービス。あなたのチームは私達に助けおよび解決を、私達によってがいつもよいパートナーである希望常に与えます!

—— クリス ロジャース

オンラインです

High Performance Thermal Pad Manufacturer Soft Silicone Thermal Cooling Pad For Laptop AI Processors Cooling

High Performance Thermal Pad Manufacturer Soft Silicone Thermal Cooling Pad For Laptop AI Processors Cooling

大画像 :  High Performance Thermal Pad Manufacturer Soft Silicone Thermal Cooling Pad For Laptop AI Processors Cooling

商品の詳細:
起源の場所: 中国
ブランド名: ZIITEK
証明: UL and RoHs
モデル番号: TIF500-50-11E
お支払配送条件:
最小注文数量: 1000個
価格: 交渉可能
パッケージの詳細: 1000 個/バッグ
受渡し時間: 3-5作業日
支払条件: T/T
供給の能力: 10000/日
詳細製品概要
製品名: 高性能サーマル パッド メーカーのラップトップ AI プロセッサ冷却用ソフト シリコーン熱冷却パッド キーワード: シリコン熱冷却パッド
申請について: ラップトップ AI プロセッサーの冷却 熱伝導率: 5.0W/m-k
硬度: 35海岸00 厚さの範囲: 0.25~5.0mm(0.010~0.20インチ)
色: 濃い灰色 建設と合成: セラミック充填シリコーンエラストマー

High Performance Thermal Pad Manufacturer Soft Silicone Thermal Cooling Pad For Laptop AI Processors Cooling


Company Profile


Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
 

Products description


TIF®500-50-11E Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces,and the susceptibility of precision components to mechanical damage in high-precision assemblies.


Features:

 

> High thermal conductivity
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

> Easy release construction
> Electrically isolating
> High durability


Applications:

 

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

> Display card
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices

> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator

 

 

Typical Properties of TIF®500-50-11E Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.3 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.5) (0.75~5.0)
Hardness 65 Shore 00 35 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 9.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 5.0 W/m-K ASTM D5470
5.0 W/m-K ISO22007

 

High Performance Thermal Pad Manufacturer Soft Silicone Thermal Cooling Pad For Laptop AI Processors Cooling 0

Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"× 16" (406 mm×406 mm)
 
Component Codes:
 
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

High Performance Thermal Pad Manufacturer Soft Silicone Thermal Cooling Pad For Laptop AI Processors Cooling 1

FAQ:

 

Q: Are you trading company or manufacturer ? 

A: We are manufacturer in China.

 

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

 

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

連絡先の詳細
Dongguan Ziitek Electronic Materials & Technology Ltd.

コンタクトパーソン: Dana Dai

電話番号: 18153789196

私達に直接お問い合わせを送信 (0 / 3000)

その他の製品