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商品の詳細:
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| 製品名: | 自動車および電子用途の熱伝達用の高熱伝導率 4.0WmK を備えた低揮発性サーマルギャップフィラーシリコンパッド | 比重: | 3.1g/cm3 |
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| 熱伝導率と堆積物: | 4.0 W/m-K | 連続使用温度: | -40 200℃に |
| 硬度: | 65/35 ショア00 | 工事: | セラミック充填シリコーンエラストマー |
| 色: | 白 | キーワード: | サーマルギャップフィラーシリコンパッド |
| 応用: | 自動車および電子用途における熱伝達用 |
Products description
The TIF®100L 4035-06 Series is a soft, low-volatility thermal pad designed specifically for demanding application environments. While providing high thermal conductivity,
it significantly reduces the content of volatile silicones. Its high flexibility allows it to fill uneven interfaces effectivelyprotecting delicate electronic components from mechanical stress damage. This series is an ideal thermal interface material of choice for fields sensitive to volatile substances,such as aerospace,automotive electronics, optical devices, and high-end communication equipment.
Features:
> High thermal conductivity
> Low volatility
> High reliability
> Easy to install and operate
Applications:
> Automotive Electronics
> Aerospace
> Optical display
> High-end communication
> Industrial Electronics
| Typical Properties of TIF®100L 4035-06 Series | |||
| Property | Value | Test method | |
| Color | white | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.1 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.0) | ||
| Hardness | 65 Shore 00 | 35 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 7.3 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1012 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 4.0 W/m-K | ASTM D5470 | |
| 4.0 W/m-K | ISO22007 | ||
Product Specifications
Standard Thickness: 0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mmX406 mm).
The TIF series is available in custom shapes and various forms.
For other thicknesses or more information,please contact us.
Company Profile
Ziitek Electronic Material and Technology Ltd(ZIITEK) has been deeply involved in the field of heat conducting materials for 20 years, and is a high-tech enterprise integrating R&D, production and sales. Headquartered in Dongguan, with four production bases in Kunshan, Taiwan Province and Viet Nam, the global delivery capacity is stable and reliable. Mainly engaged in thermal conductive silica pads, thermal conductive graphite sheets, thermal conductive insulation materials, PCM phase change materials, thermal conductive plastics, thermal conductive silicone grease/paste, thermal conductive gel, thermal conductive epoxy potting glue, thermal conductive silicone adhesive, silicone foam, and silicon-free thermal pads. The core explosive heating plate is widely recognized by the market. Our products have passed ISO9001 and IATF16949 certification, and meet RoHS/UL standards, and are widely used in new energy, 5G, data center, automotive electronics and other fields.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
コンタクトパーソン: Dana Dai
電話番号: +86 18153789196
Japanese
