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商品の詳細:
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| 製品名: | 電子デバイスの熱放散用熱伝導パッドにより、熱管理とパフォーマンス向上を確保 | 連続使用温度: | -40 ℃〜200℃ |
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| 密度: | 2.1g/cm3 | 応用: | 電子機器の放熱 |
| 硬度: | 65/60 ショア00 | キーワード: | 熱伝導性のパッド |
| 色: | グレー | 熱伝導率と堆積物: | 1.5W/mK |
| 厚さ: | 0.010〜0.20inch / 0.25〜5.0mmt | 工事: | セラミック充填シリコーンエラストマー |
| Property | Value | Test Method |
|---|---|---|
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | ****** |
| Density (g/cm³) | 2.1 | ASTM D792 |
| Thickness Range (inch/mm) | 0.010~0.020 | 0.030~0.200 0.25~0.50 | 0.75~5.0 |
ASTM D374 |
| Hardness (Shroe 00) | 65 | 60 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** |
| Breakdown Voltage (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant @ 1MHz | 4.5 | ASTM D150 |
| Volume Resistivity | ＞1.0×10¹² Ohm-meter | ASTM D257 |
| Flame rating | V-0 | UL 94 (E331100) |
| Thermal conductivity | 1.5 W/m-K | ASTM D5470 ISO22007 |
Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm×406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
Packaging Details:
Lead Time:
Quantity: 5000 pieces
Estimated Time: To be negotiated
コンタクトパーソン: Dana Dai
電話番号: +86 18153789196
Japanese
