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2.0W/mK Blue Thermal Conductive Pad Flexible Compressible Silicone For Low Stress Applications In Electronic Heat Dissipation Systems

認証
中国 Dongguan Ziitek Electronic Materials & Technology Ltd. 認証
中国 Dongguan Ziitek Electronic Materials & Technology Ltd. 認証
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2.0W/mK Blue Thermal Conductive Pad Flexible Compressible Silicone For Low Stress Applications In Electronic Heat Dissipation Systems

2.0W/mK Blue Thermal Conductive Pad Flexible Compressible Silicone For Low Stress Applications In Electronic Heat Dissipation Systems
2.0W/mK Blue Thermal Conductive Pad Flexible Compressible Silicone For Low Stress Applications In Electronic Heat Dissipation Systems 2.0W/mK Blue Thermal Conductive Pad Flexible Compressible Silicone For Low Stress Applications In Electronic Heat Dissipation Systems 2.0W/mK Blue Thermal Conductive Pad Flexible Compressible Silicone For Low Stress Applications In Electronic Heat Dissipation Systems

大画像 :  2.0W/mK Blue Thermal Conductive Pad Flexible Compressible Silicone For Low Stress Applications In Electronic Heat Dissipation Systems

商品の詳細:
起源の場所: 中国
ブランド名: ZIITEK
証明: UL and RoHs
モデル番号: TIF100-20-05E
書類: TIF100-20-05E_Data Sheet .pdf
お支払配送条件:
最小注文数量: 1000個
価格: 交渉可能
パッケージの詳細: 1000 個/バッグ
受渡し時間: 3~5営業日
支払条件: T/T
供給の能力: 100000個/日

2.0W/mK Blue Thermal Conductive Pad Flexible Compressible Silicone For Low Stress Applications In Electronic Heat Dissipation Systems

説明
製品名: 電子放熱システムの低応力用途向けの 2.0W/mK 青色熱伝導パッド柔軟な圧縮性シリコーン キーワード: 熱伝導性のパッド
色: 硬度: 65/35 ショア00
熱伝導率: 2.0W/m-K 比重: 2.5 g/cmの³
推奨動作温度 (%22C): -40 200℃に 耐電圧 (V/mm): ≥5500 VAC
応用: 電子放熱システムの低応力用途向け

2.0W/mK Blue Thermal Conductive Pad Flexible Compressible Silicone For Low Stress Applications In Electronic Heat Dissipation Systems
Company Profile

Dongguan Ziitek Electronic Material and Technology Ltd. is a professional manufacturer of thermal interface materials with many years of industry experience. Integrating R&D, production, sales, and technical services, the company offers a comprehensive product line covering thermally conductive silicone pads, thermal conductive grease/paste, thermally conductive graphite sheets, phase change materials, thermally conductive plastics, thermal gel, silicone foam, silicone-free thermal pads etc. We adhere to strict quality standards and provide customized solutions based on customer requirements. Our products are widely used in electronics, new energy, telecommunications, industrial control, and other fields, earning the trust of customers both domestically and internationally through our proven capabilities.

Product Description

TIF®100-20-05E Series is a well-balanced, general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.

Features
  • Good thermal conductive: 2.0W/mK
  • Moldability for complex parts
  • Soft and compressible for low stress applications
  • Broad range of hardnesses available
  • Outstanding thermal performance
  • High tack surface reduces contact resistance
Applications
  • Power tools
  • Network communication products
  • Electric vehicle batteries
  • Computer CPU/GPU Cooling
  • New energy vehicle power systems
  • Heat pipe thermal solutions
  • Memory Modules
  • Mass storage devices
  • Automotive electronics
  • Set top boxes
Typical Properties of TIF®100-20-05E Series
Property Value Test method
Color Blue Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 2.5 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
(0.25~0.50) | (0.75~5.0)
ASTM D374
Hardness (Shroe 00) 65 | 35 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 4.5 ASTM D150
Volume Resistivity >1.0X10¹² Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 2.0 W/m-K
2.0 W/m-K
ASTM D5470
ISO22007
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"X16" (406 mmX406 mm)

Component Codes

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

TIF 100-20-05E Thermal Conductive Pad Product Image
Why Choose Us?
  • Our value message is "Do it right the First time, total quality control"
  • Our core competencies is thermal conductive interface materials
  • Competitive advantage products
  • Confidentiality agreement Business Secret Contract
  • Free sample offer
  • Quality assurance contract
Frequently Asked Questions
Q: What's the thermal conductivity test method given on the data sheet?

A: All the data in the sheet are actual tested. Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Q: How to find a right thermal conductivity for my applications?

A: It depends on the watts of power source, ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

Q: Do you accept custom orders?

A: Yes, welcome to custom orders. Our custom elements including dimension, shape, color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order, please kindly offer a drawing or leave your custom order information.

連絡先の詳細
Dongguan Ziitek Electronic Materials & Technology Ltd.

コンタクトパーソン: Dana Dai

電話番号: +86 18153789196

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