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Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices

認証
中国 Dongguan Ziitek Electronic Materials & Technology Ltd. 認証
中国 Dongguan Ziitek Electronic Materials & Technology Ltd. 認証
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Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices

Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices
Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices

大画像 :  Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices

商品の詳細:
起源の場所: 中国
ブランド名: ZIITEK
証明: UL and RoHs
モデル番号: TIF100L 3040-06
書類: TIF100L 3040-06_Data Sheet.pdf
お支払配送条件:
最小注文数量: 1000個
価格: 交渉可能
パッケージの詳細: 1000 個/バッグ
受渡し時間: 3-5作業日
支払条件: T/T
供給の能力: 10000/日

Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices

説明
製品名: 電子デバイスの熱管理と長期動作安定性を確保する低揮発性サーマルギャップフィラーパッド 工事: セラミック充填シリコーンエラストマー
キーワード: 熱ギャップフィルターのパッド 硬度: 65/40 ショア 00
推奨動作温度 (°C): -40 200℃に 耐電圧: ≥5500
サンプル: サンプル無料 熱伝導性(w/mk): 3.0W/mK
炎の評価: UL 94 V-0 応用: 電子機器

Low Volatility Thermal Gap Filler Pads
Product Overview

The TIF®100L 3040-06 Series is an ultra-low silicon oxygen volatilization thermal pad designed specifically for the thermal management needs of optical and high-precision electronic devices. This material balances efficient thermal conductivity with extremely low precipitation of condensable volatile substances, effectively avoiding pollution to sensitive optical components and precision circuits.The material features excellent flexibility and elasticity, enabling it to fully fill micro gaps between heating interfaces and heat dissipation structures. This significantly reduces contact thermal resistance, improves thermal conductivity efficiency, and ensures the reliability and service life of electronic components in long-term operation.

Key Features
  • Ultra low volatility of siloxane
  • Good thermal conductivity
  • Excellent weather resistance and aging resistance
  • Highly compressible, easy to install and operate
  • Good insulation performance
Applications
  • Motor Controller (MCU)
  • Airborne computer
  • Machine vision camera
  • High performance ASIC chip
  • Central control screen
Technical Specifications of TIF100L 3040-06 Series
Property Value Test Method
Color White Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 3.0 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.00
ASTM D374
Hardness (Shore 00) 65 | 40 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Volume Resistivity (Ohm-meter) >1.0×10¹² ASTM D257
Flame rating V-0 UL 94 (E331100)
∑ZD3-D10 (PPM) <100 GC-MS
Thermal conductivity (W/m-K) 3.0 ASTM D5470
ISO22007
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm), with increments of 0.010" (0.25 mm).

Standard Size: 16"×16" (406 mm×406 mm)

The TIF® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

TIF 100L 3040-06 Thermal Gap Filler Pad product photo
Packaging & Lead Time

Packaging Details:

  • With PET film or foam for protection
  • Paper card to separate each layer
  • Export carton inside and outside
  • Customized packaging available to meet customer requirements

Lead Time:

Quantity: 5000 pieces

Estimated Time: To be negotiated

Frequently Asked Questions
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, most thermal gap pad surfaces have double side natural inherent tack. Non-stick surface can also be treated according to customer's requirements.
Q: Are you trading company or manufacturer?
A: We are manufacturer in China.

連絡先の詳細
Dongguan Ziitek Electronic Materials & Technology Ltd.

コンタクトパーソン: Dana Dai

電話番号: +86 18153789196

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