Silicone Based Ultra Soft Thermal GAP PAD Materials For AI Processors AI Servers TIF®100-50-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity ... 続きを読む
液体金属熱パスト CPU GPU 冷却 PC AMD インテル プロセッサ 冷却 熱パスト TIG®7835Lliquid metal achieves liquid state and low surface tension characteristics at room temperature through new material technology and alloying process (different from ordinary metals that need to be heated to melting point for liquefaction)高流動性と優れた... 続きを読む